xMEMS Labs, the pioneer of solid-state MEMS speakers and breakthrough μCooling™ fan-on-a-chip technology, today announced its CES 2027 demonstrations, highlighting how its piezoMEMS platform is helping manufacturers overcome critical physical constraints in edge AI devices: heat, size, weight, and aesthetics. From actively cooled smartphones and ultralight AI/AR glasses to headphones and wearable devices, xMEMS technologies enable more powerful, comfortable, and compact consumer electronics. Visitors to CES 2027, January 6-9 in Las Vegas, can experience live demonstrations including previews of recent customer design wins, upcoming product innovations, and applications not yet publicly announced.

Across the CES show floor, OEMs and ODMs are racing to bring increasingly capable AI experiences into smaller form factors. xMEMS cooling and audio solutions address these physical limitations at the component level, creating new opportunities for next-generation smartphones, AI smart glasses, wearables, solid-state drives, personal audio products, and a growing range of AI-enabled consumer electronics.

“Realizing the potential of edge AI requires overcoming the physical constraints that shape device performance and the user experience,” said Joseph Jiang, CEO at xMEMS Labs. “Our solid-state cooling and audio technologies address those constraints at the component level, giving manufacturers greater freedom to combine advanced computing, high-quality sound, and comfortable designs. That foundation is essential to bringing more capable AI devices to the mass market.”

Solid-State Cooling Enables Sustained Edge AI Performance

As device intelligence increases, so do thermal demands. xMEMS μCooling technology provides silent, vibration-free active airflow in form factors where traditional fans cannot operate, helping manufacturers manage temperatures while preserving thin, lightweight designs.

At CES, xMEMS will demonstrate active micro-cooling solutions for:

  • AI glasses and smart eyewear

  • Smartphones and foldables

  • Headphones and wearable devices

  • SSDs (M.2 & Personal Storage)

Together, the company’s XMC-1200, XMC-2400, and XMC-4800 platforms illustrate how active silicon cooling can complement passive heat spreading to maintain performance and improve user comfort in space-constrained AI products.

Solid-State Audio Shapes the AI User Experience

For many AI applications, audio performance and user comfort are becoming increasingly important. xMEMS will demonstrate solid-state speaker technologies powering AI glasses, ultralight headphones, OWS earbuds, and premium hybrid audio systems. These demonstrations highlight how semiconductor-based audio can deliver immersive sound while enabling lighter, more comfortable wearable products for all-day use.

xMEMS will also preview its next-generation solid-state loudspeaker platform, weighing approximately 90% less than conventional speaker solutions and planned for production in Q1 2027.

Growing Customer Adoption Across Audio and Cooling

CES 2027 follows a year of significant commercial momentum for xMEMS. The company recently achieved its first production adoption in over-ear headphones with Nothing Headphone (1) Pro, while cumulative shipments of its solid-state speaker technologies have surpassed one million units. At the same time, XMC-2400 and XMC-4800 μCooling products have entered mass production, expanding xMEMS’ reach from AI glasses and personal electronics to data center infrastructure.

Visitors to the xMEMS suite will also receive an early look at upcoming product introductions and recent customer design wins that further expand the company’s presence across Edge AI devices.

“What makes this year’s CES different is that we’re demonstrating technologies that are increasingly moving into commercial products,” Jiang added. “Growing customer adoption across both cooling and audio validates the need for component-level solutions that help manufacturers overcome thermal and user-experience challenges in next-generation Edge AI devices.”

Learn more at xmems.com. For hi-res imagery, please click here.

About xMEMS Labs

xMEMS Labs, Inc. is advancing the foundation of AI hardware by eliminating longstanding constraints in thermal and audio design. Its proprietary piezoMEMS platform enables a portfolio of thin and light solid-state speakers and µCooling solutions that deliver silent, reliable, chip-level performance for increasingly compact and powerful devices, including SSDs, smartphones, AI glasses, and AR/XR systems. Based in Santa Clara, California, xMEMS is enabling sustained performance in the next era of AI computing. Visit xmems.com.

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